Record Citations
APA CitationWong, E., & Mai, Y. (2015). Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Woodhead Publishing.
Chicago Style CitationWong, E-H, and Y.-W Mai. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Woodhead Publishing, 2015.
MLA CitationWong, E-H, and Y.-W Mai. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Woodhead Publishing, 2015.
Harvard Style CitationWong, E. & Mai, Y. 2015. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Woodhead Publishing.
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