Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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| Language |
English |
|---|---|
| Publisher |
Woodhead Publishing,
2015
|
| ISBN |
1-84569-528-3 0-85709-911-6 |
| Get full text | |